On May 9, 2024, DJI Holdings, an international leading semiconductor component distributor dedicated to the Asia Pacific market, announced that its subsidiary Pinka has launched an automotive thermal management solution based on the Infineon Aurix TC334 chip.

With the green transformation and technological innovation of the global automotive industry, vehicle thermal management systems have become a key factor in improving energy efficiency and ride comfort. Compared with traditional fuel vehicles, new energy vehicles have more complex and demanding requirements for thermal management systems. Electric and hybrid vehicles not only need to manage the engine temperature, but also ensure that the battery pack, electric motor, and power electronic equipment are in the optimal temperature range to maintain performance and extend service life. In this context, Da Lian Da Pin Jia has launched an automotive thermal management solution based on Infineon Aurix TC334 MCU, which can monitor and manage the temperature changes of automotive components in real time, keeping them always within the appropriate temperature range.

This solution is based on Infineon Aurix TC334 MCU as the core, equipped with TLE9271QX PMIC/SBC chip, TLE94112ES multi way half bridge IC, BSP726T and BSP75N intelligent power switches, as well as analog switches such as 74HC4051. Among them, is Aurix TC334 MCU Infineon Aurix? The second generation MCU product of the series adopts a high-performance six core architecture, with excellent real-time performance, functional security level up to ASIL-D, and integrates information security hardware encryption modules and powerful interconnection interfaces inside the device, suitable for many automotive applications.

The excellent performance and reliability of this solution can quickly help users complete the development and design of thermal management systems. Thanks to the excellent performance of the device, the solution can intelligently adjust the vehicle temperature based on the vehicle's operating conditions and external environmental changes, indirectly ensuring the vehicle's power and economic performance.

Core technological advantages:

Infineon Aurix TC334:

High performance MCU with lock step core based on TriCore 1.6.2. P;

Integrate data processing units such as DSP and FPU;

Rich peripherals, including communication interfaces such as QSP, CAN, ASCLIN, SENT, etc;

Integrate Hardware Security Module (HSM) for data encryption, etc;

Integrate Security Management Unit (SMU) for security monitoring;

Support functional safety level ASIL-D.

Scheme specifications:

Adopting Infineon Aurix TC334 MCU and TLE92XX series SBC;

Reserve SPI interface to communicate with external three-phase bridge drivers or MCU for controlling BLDC;

The half bridge drive with Infineon TLE94112 integrated MOS can be used to control low-power brushless motors;

Equipped with Infineon BSP7 series high edge switches for controlling valves;

12V voltage input, all IO ports support 3V/5.5V drive;

Reserve sensor interfaces to collect external environmental information.