On January 8, 2025, Tokyo, Japan - Honda Motor Corporation (TSE: 7267) and Renesas Electronics Corporation (TSE: 6723) announced today that they have signed an agreement to develop high-performance System on Chip (SoC) for Software Defined Vehicles (SDVs). This new SoC aims to provide leading AI performance of 2000 TOPS (Note 1) and outstanding power efficiency of 20 TOPS/W, and is planned to be used for future models of Honda's new electric vehicle (EV) series: the "Honda 0 (Zero) series", particularly for models to be launched in the late 2020s. The agreement was announced on January 7th at the CES 2025 Honda press conference held in Las Vegas, Nevada, USA.

图示：Honda Senior Managing Executive Officer, Katsushi Inoue（左），Renesas SVP Vivek Bhan（右）

Honda is developing an original SDV to provide an optimized mobile experience for every customer in the Honda 0 series. The Honda 0 series will adopt a centralized E/E architecture, combining multiple electronic control units (ECUs) responsible for controlling vehicle functions into one ECU. The core ECU is the "heart" of SDV, responsible for managing basic vehicle operations such as advanced driver assistance systems (ADAS), autonomous driving (AD), powertrain control, and comfort functions, all of which are efficiently executed on a single ECU. To achieve this goal, the ECU needs to be equipped with a SoC that not only provides processing performance far beyond traditional systems, but also minimizes the increase in power consumption to the greatest extent possible.

Renesas is committed to providing automotive semiconductor solutions and helping automotive OEMs develop SDVs. Renesas' R-Car solution utilizes multi die chiplets (Note 3) and integrates AI accelerators (Note 4) into its SoC, providing higher AI performance and customization capabilities.

In order to realize Honda's vision for SDV, Honda has reached an agreement with Renesas to jointly develop high-performance SoC computing solutions specifically designed for core ECUs. This SoC adopts TSMC's leading 3-nanometer automotive process technology, which can significantly reduce power consumption. In addition, it also implements a system that utilizes multi die chiplet technology, combining Renesas' Gen 5 R-Car X5 SoC series with Honda's independently developed AI accelerator for AI software optimization. Through this combination, the system aims to achieve industry-leading AI performance and energy efficiency. SoC chip solutions will provide AI performance required for advanced functions such as AD while maintaining low power consumption. Chiplet technology allows for flexible creation of customized solutions and provides future upgrades to improve functionality and performance.

Honda and Renesas have maintained close cooperation for many years. This agreement will accelerate the integration of advanced semiconductor and software innovation into the Honda 0 series, enhancing customers' travel experience.

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