In 2024, the integrated circuit industry will continue to develop amidst changes and opportunities. Faced with the new normal of the global economy, accelerated technological innovation, and constantly changing market demand, how can integrated circuit companies maintain competitiveness and achieve sustainable development in the new year? Xin Yaohui Technology Co., Ltd. (hereinafter referred to as "Xin Yaohui"), a leading IP enterprise in the integrated circuit industry, shares its experience and achievements over the past year, and looks forward to future development trends and opportunities.

In the current era of rapid technological development, artificial intelligence is experiencing explosive growth. The widespread popularity of AI chips and the rapid progress of software defined systems are accelerating the arrival of the era of intelligent everything. Entering the post Moore era, the traditional path of chip development has encountered bottlenecks, while advanced packaging technologies such as 3DIC and Chiplet have emerged, providing new impetus for breaking through the impasse. These technologies not only open up new directions for improving chip performance and integration, but also bring innovative solutions, becoming an important driving force for the continuous progress of the chip industry.

In the context of this era, IP and IC design technology are at a critical juncture of a new round of transformation, ushering in unprecedented opportunities. In complex chip design architectures, various types of IPs play a crucial role, serving as indispensable bridges connecting the internal computing modules of the chip with external devices. Due to the need to process and transmit massive amounts of data, AI chips not only require high-speed data exchange between different computing modules within the chip, such as CPU, GPU, and NPU, which are interconnected through IP interfaces such as UCIe and Die to Die to achieve high bandwidth and low latency, but also require efficient, scalable, and consistent interconnection with external devices, such as high-speed and accurate data transmission with storage and network devices through IP interfaces such as PCIe and Serdes. Moreover, AI chips require frequent reading and writing of large amounts of data during operation, with extremely high requirements for memory bandwidth and capacity. By using interfaces such as HBM, DDR, LPDDR, etc. to achieve high-speed data transmission between IP and storage particles, bandwidth bottlenecks can be effectively solved, data flow between chips and memory can be accelerated, and the memory capacity and bandwidth requirements of AI chips can be met from various aspects. So in the field of AI chips, interface IP can not only significantly improve the performance of AI chips, but also achieve functional optimization and expansion, helping customers fully unleash their design potential and play an increasingly critical role.

Creating a one-stop complete IP platform solution to achieve strategic transformation from traditional IP to IP2.0

Looking back at 2024, the domestic semiconductor industry has experienced many internal and external challenges. Nevertheless, it was still a fruitful year for Xin Yaohui.

In the face of the rapid rise of the artificial intelligence market, high-speed interface IPs such as UCIe, HBM3E, and 112G SerDes launched by Chip Yaohui are widely used in Chiplets and artificial intelligence fields. UCIe technology solves the D2D interconnection problem within Chiplets, HBM improves the interconnection efficiency between high bandwidth memory and chips, and 112G SerDes achieves high-speed interconnection between chips, significantly improving cluster efficiency.

UCIe, with its high bandwidth density, low transmission latency, PCIe and CXL multiplexing advantages, has become the preferred D2D interconnect standard in Chiplets. The UCIe IP launched by Xinyaohui covers two major modules: PHY and Controller IP. The PHY IP can support a maximum speed of 32Gbps in advanced packaging and up to 24Gbps in standard packaging, and has excellent energy efficiency and low transmission latency. The maximum transmission distance supports 50mm, far exceeding the standard protocol's 25mm, providing customers with greater flexibility and scalability for Chiplet solutions. At the same time, Controller IP is compatible with multiple interfaces such as FDI, AXI, CXS. B, allowing customers to seamlessly switch with system design during integrated use.

HBM stands out in fields such as AI and high-performance computing due to its high bandwidth, low power consumption, and low latency characteristics. Xinyaohui has also launched domestically produced HBM3E PHY and Controller IP, where the PHY can support a maximum transmission rate of 7.2Gbps, and the Controller has excellent bandwidth utilization, with a maximum speed of 10Gbps. In the SerDes field, Serdes IP has become the preferred solution for internal connections and external communication in data centers due to its high data transmission rate and low power consumption characteristics. Xin Yaohui has launched different combinations of SerDes PHY, supporting up to 112Gbps, and supporting multiple protocols such as PCIe, OIF, and Ethernet to meet the speed requirements of different customers. At the same time, Xinyaohui has also launched controller IPs compatible with PCIe and CXL, providing a one-stop solution for customers' IP selection and integration challenges.

Xin Yaohui successfully developed the above-mentioned high-speed IP in 2024 and has completed delivery. During the research and development process, Xin Yaohui had in-depth discussions with numerous customers and reached cooperation intentions. After the product was launched, it quickly received positive feedback from customers in fields such as artificial intelligence, data centers, and high-performance computing, and established in-depth cooperation with them.

It is worth mentioning that in 2024, Xinyaohui successfully achieved a strategic transformation from traditional IP to IP2.0, helping customers gain an advantage in the fierce market competition. A comprehensive upgrade has been achieved through a one-stop complete IP platform solution, which not only provides high-performance, low-power, and strongly compatible high-speed interface IP, but also provides basic IP and controller IP to help SoC customers improve performance from the inside out. Emphasize the reliability, compatibility, and mass production capability of the product, provide system level packaging support, optimize PHY layout, Bump and Ball layout, improve mass production performance, and help customers accelerate product launch. At the same time, Xin Yaohui provides end-to-end solutions by integrating complete subsystem resources, from scheme development to integration verification, to hardening and packaging testing. In addition, Xinyaohui actively promotes the domestic supply chain, provides reference for substrate and Interposer design, collaborates with upstream and downstream industrial chains, and helps to achieve technological breakthroughs in the industry.

AI brings new growth to the semiconductor IP industry, and domestic IP faces both opportunities and challenges

As the global semiconductor IP market continues to grow, emerging fields such as artificial intelligence, data centers, and smart cars are bringing new growth to the semiconductor IP industry. The increasing demand for high-performance chips in these fields has greatly promoted the sustained development of the IP market, especially the growing demand for interface IP. However, with some uncertain external factors, the demand for localization has become more urgent, and the iteration speed of advanced domestic processes has slowed down, providing opportunities but also bringing great challenges to the localization of IP.

Opportunities arise as the demand for localization drives, and domestic chips, backed by their vast market advantages, provide ample space for the development of domestic IP. In the future, the market will steadily expand, especially for Chiplet related products and services, which are bound to usher in a period of vigorous development.

The challenge comes from the slowing down of the iteration speed of advanced domestic processes and the increasing difficulty of obtaining advanced foreign processes. In this context, SoC will put forward higher requirements for domestic IP, requiring faster interface IP design on the basis of existing processes, undoubtedly increasing the difficulty and cost of IP design. meanwhile, Chiplets, as the preferred solution for SoC architecture improvement, can address these challenges but also bring a series of challenges such as packaging, testing, and mass production, which will also affect IP design. Therefore, IP companies not only need to provide reliable, compatible, and mass-produced IP products, but also need to have strong system packaging design and supply chain management capabilities to ensure the smooth implementation of the overall solution.

Faced with such opportunities and challenges, Xin Yaohui will continue to optimize the existing process interface IP to meet the diverse application needs of customers. By improving the performance of interface IP, it will fully unleash the potential of domestic processes. At the same time, it will keep up with the pace of protocol evolution and gradually introduce interface IP that complies with advanced protocol standards such as DDR6, LPDDR6, PCIe7, etc. In addition, Foundation IP will be expanded to cover different Foundries and processes, and more performance optimized digital controller IPs will be launched to provide customers with a wider range of choices and stronger technical support.

In the emerging Chiplet market, Xin Yaohui will provide system level packaging design solutions to help customers launch highly reliable and mass-produced Chiplet IP products, and work together with domestic upstream and downstream enterprises to create a complete domestic supply chain. In the field of automotive grade chips, with the rich experience and IP accumulation of Xinyao Hui in AEC-Q100 and ISO 26262 functional safety certification, the company will further expand the coverage of automotive grade IP solutions, assist customers in accelerating functional safety assessments, ensure the achievement of corresponding target ASIL levels, and help SoC customers shorten the time for design, certification, and product release, and reduce costs.

Xin Yaohui believes that as a local IP authorization service enterprise, it is necessary to have a deep understanding of customer needs, comprehensively grasp customer application scenarios and actual requirements, develop IP products that fully meet customer needs, and provide IP related services that meet customer needs. At the same time, we cannot become industry followers and only seek domestic alternative solutions. Instead, we should focus on market demand and do things that other domestic manufacturers have not done well but are very difficult. Focus on making difficult and valuable products, improve the industrial chain, provide strong support for the industry through IP authorization and services, and create maximum value for the chip industry.

The current and next decade will be a golden decade for the semiconductor industry, especially for China's semiconductor industry. Despite the slowdown in growth since last year and the more severe lockdown situation this year, we still firmly believe that the semiconductor industry will usher in a comprehensive recovery. In such a market change process, we can highlight the advantages of Xin Yaohui in truly tackling difficulties and doing practical things, and solidly promoting technological innovation and solutions. With the arrival of industry recovery, the company will usher in greater growth opportunities.

Looking ahead to 2025, Xin Yaohui will take the new mature IP2.0 solution as its core, combining high reliability, mass-produced IP combinations, complete subsystem solutions, system level packaging design, and strong supply chain capabilities to anticipate and solve various challenges that customers may encounter in IP applications, and better adapt to market innovation needs.

This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry

They are committed to providing customers around the world with the most necessary, outdated, licensed, and hard-to-find parts.

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Name: John Chen

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