On December 10, 2024, Da Da Da Lian Holdings, an internationally leading semiconductor component distributor dedicated to the Asia Pacific market, announced that its subsidiary, Shiping, has launched a BCM (Body Control Module) development board solution mainly based on SemiDrive E3106 MCU, supplemented by chips from onsemi, NXP and other subsidiaries as peripheral devices.

With the continuous progress and innovation of the automotive industry, BCM has become an indispensable component of modern automobiles. It is not only responsible for monitoring and managing various electrical systems and equipment in vehicles, such as interior and exterior lighting, window and door control, vehicle locking systems, anti-theft devices, car audio systems, and cockpit environment control, but also ensures the efficient operation of these systems through microprocessors and pre-set software programs, and provides real-time feedback to drivers to enhance driving experience and safety. In order to accelerate the development of BCM modules by manufacturers, Da Da Da Da Da Da Shi Ping has launched a BCM development board solution mainly based on Xinchi Technology E3106 MCU, equipped with onsemi NCV8730 low dropout regulator (LDO), NXP FS5600 automotive system basic chip (SBC), TJA1044GT/32 CAN transceiver, TJA1022 LIN transceiver and other products.

The E3106 MCU is a product of Xinchi Technology's E3 Control Core series, which is equipped with a 300MHz ARM Cortex-R5 core and up to 1152KB of RAM, meeting the ISO 26262 ASIL-B automotive functional safety level. This MCU has 16 memory protection units and supports error checking and correction functions on cache and TCM. In addition, E3106 also has 32 independent DMA channels and supports multiple peripheral interfaces, such as 100/1000M Ethernet TSN, CAN/CANFD, LIN/UART, I2C, etc., which facilitate communication and data exchange with other in vehicle devices?. At the same time, the device also supports JTAG debugging, PMU management, 32KHz RTC, 24MHz XTAL and other functions to meet diverse application requirements.

Moreover, E3106 supports multiple mainstream development environments, such as IAR Embedded Workbench for ARM, making it convenient for developers to write, debug, and test code. In addition, it also provides comprehensive software platform support, including E3 MCAL (Microcontroller Abstraction Layer) and E3 SSDK (Software Development Kit), which help simplify the user development process.

As the technology installed in cars becomes increasingly advanced, the functions and features that need to be managed by the body control module are also increasing. The BCM development board solution launched this time provides developers with a comprehensive and highly integrated development platform, which not only greatly helps users accelerate the development process, but also injects vitality into the development of automotive intelligence.

Core technological advantages:

The size of the evaluation board is 4mm × 159.3mm, and it is based on Arm? Cortex-R5F microcontroller meets the application development requirements of ASIL-B automotive functional safety level;

Adopting a high-performance multi-core architecture, including independent AP application processors and information security processors, providing powerful computing and processing capabilities;

There are three wake-up sources, SYS-BUTTON, SYS_0AKEUP0, and SYS_0AKEUP1, which can be classified into three types based on the type of peripheral wake-up: level triggered, rising edge triggered, and falling edge triggered;

Paired with the expandable third-generation safety power management chip FS56, it achieves comprehensive power monitoring and management as well as failure safety protection;

Specialized interface design combined with NXP FS56 GUI tool, providing FS56 simulation and OTP burning functions;

Two high-speed CAN transceivers and two LIN 22A/SAE J2602 transceivers;

Rich communication interfaces: SPI, I2C, UART, CAN/FD, and Ethernet with TSN support;

Provide RMII interface, which can flexibly interface with development boards for vehicle Ethernet and industrial Ethernet, to achieve vehicle network development;

Supports JTAG standard debugging interface and JTAG 4-wire SWD debugging mode.

Scheme specifications:

Main control MCU (E3106):

300 MHz ARM Cortex-R5 CPU core and up to 1152KB RAM, compliant with ISO 26262 ASIL-B automotive functional safety level, supporting ASIL B safety applications;

Memory protection unit with 16 regions, error checking and correction on cache and TCM;

The security domain has 32 independent DMA channels, and a DMA multiplexer can be configured between the peripheral module and the DMA controller;

Efficient high current mode DC/DC regulator, supporting the conversion of 3V power supply to 1.8V or 0.8V, with overvoltage/undervoltage and overcurrent protection functions;

Supports JTAG PMU、32KHz RTC、24MHz XTAL；

Peripheral interfaces: 100/1000M Ethernet TSN, CAN/CANFD x 8, LIN/UART x 12, I2C x 4, ACMP x 2, 12 bit ADC x 3, eTimer (8-ch) x 2, ePWM (8-ch) x 2, etc., facilitating communication and data exchange with other onboard devices;

Support multiple mainstream development environments, such as IAR Embedded Workbench for ARM, to facilitate developers in coding, debugging, and testing;

Providing comprehensive software platform support, including E3 MCAL (Microcontroller Abstraction Layer) and E3 SSDK (Software Development Kit), can help accelerate the development process and improve development efficiency.

Vehicle grade high-speed CAN transceiver (TJA1044) specifications:

Compliant with the CAN physical layer defined in ISO 11898-2:2016, SAE J2284-1 to SAE J2284-5;

Equipped with extremely low current standby mode and both local and bus wake-up functions;

Suitable for 12V automotive application optimization system;

Has low electromagnetic emission (EME) and high electromagnetic immunity (EMI);

Under the fast phase of CAN FD, the data rate can reach up to 5Mbit/s;

VIO input allows direct connection to microcontrollers with power supply voltages ranging from 3V to 5V;

The data rate can reach up to 1Mbit/s.

Vehicle grade high-speed LIN transceiver (TJA1022) specifications:

Compliant with LIN2.0, LIN2.1, LIN2.2, LIN2.2A, and SAE J2602 standards;

Supports a maximum baud rate of 20kBd;

Extremely low electromagnetic radiation (EME);

In sleep mode, it has extremely low power consumption and supports remote LIN wake-up function;

Can be operated passively in an unpowered state;

Equipped with undervoltage detection function;

K-line compatibility;

Devices with compatible input levels of 3V and 5V can be directly connected to MCU microcontrollers.

Vehicle grade SBC (FS56) specifications:

Two high-voltage buck converters and four external voltage monitors;

External FET high-voltage buck controller, with a load of up to 15A and an output voltage of 8V to 7.2V;

Internal FET high-voltage step-down regulator, maximum output voltage 36V, load current greater than 3A, output voltage 1.8V to 8V;

Switching frequency from 250kHz to 3MHz;

Efficient PFM mode (700 μ W static power);

GPIO can seamlessly operate with PF PMIC;

Window based watchdog timer;

SoC hardware monitoring pins (FCCU and ERRMON) and built-in self-test and other functional safety features;

The scalable product portfolio supports multiple versions, including QM, ASIL B, and enhanced ASIL B versions.

Regarding Dahua University Holdings:

Da Da Da Da Da Holdings is an internationally leading semiconductor component distributor dedicated to the Asia Pacific market, headquartered in Taipei. It has subsidiaries such as Shiping, Pinjia, Quanding, and Youshang, with approximately 5000 employees and over 250 authorized product suppliers. The company has 73 distribution locations worldwide, with a total revenue of USD 21.55 billion in 2023. Dahua University has established an industrial holding platform, focusing on international operational scale and local flexibility, and has long been deeply rooted in the Asia Pacific market. With the vision of "industry first choice and channel benchmark", it fully implements the core values of "team, integrity, professionalism, and efficiency", and has been recognized by the "Global Distributor Excellence Performance Award" for 24 consecutive years. Faced with the trend of new manufacturing, Dalian University is committed to transforming into a data-driven enterprise, establishing an online digital platform - "DaDaWang", and advocating the intelligent logistics service (LaaS, Logistics as a Service) model to assist customers in facing the challenges of intelligent manufacturing together. Starting from good intentions and building trust through technology, the University of Hong Kong hopes to collaborate with the industry to establish a competitive ecosystem, and actively promote digital transformation with the sixteen character approach of "focusing on customers, technology empowerment, collaborative ecology, and co creating the era".

This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry

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Name: John Chen

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