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Market background
Intelligent buttons and surfaces, as important parts of automotive intelligence, are currently in a rapid development stage. Capacitive touch buttons, with their advantages of convenient operation and small size, are becoming increasingly widely used in automotive interior surfaces. For the intelligent surface of multi-channel switches such as air conditioning control panels, gear controllers, seat armrests, door trim panels, and roof controllers, a large number of MCU pins and on-chip resources are required. The Taisi Micro TCAE12 series chips can well meet the needs of such applications.
In addition, there is another major category of applications such as reading lights, window control buttons, door handles, kicks, etc. that require the use of a small number of buttons, but have higher requirements in terms of volume and cost. The market needs more optimized solutions to meet the requirements for cost and volume.
The TCAE10x series (hereinafter referred to as TCAE10) of Taisi Microelectronics is a highly integrated, low-cost, and small-sized self-contained mixed signal touch chip developed for higher cost and space requirements. In addition to adhering to the functional integration and superior performance of the TCAE12 series touch chips, TCAE10 further integrates LIN transceiver and high-voltage power supply, and integrates hardware waterproof simulation module, greatly improving waterproof effect, reducing overall power consumption, and further enhancing touch signal-to-noise ratio and stability.
TCAE10 is currently the only automotive grade touch single-chip solution in the world that can achieve both ultra-high integration and ultra-high touch performance simultaneously. TCAE10 has achieved a comprehensive surpassing of foreign chips, declaring Taisi Microelectronics' absolute leadership position in the global automotive touch chip field!
Product Features
Working voltage 5.5V~18V, supporting 40V load rejection voltage;
Low power deep sleep power consumption of 50uA, supporting LIN wake-up;
Integrated high-voltage LDO;
ARM Cortex M0 core, 48MHz high-frequency clock, 64 KB with ECC Flash and 4 KB SRAM;
Integrated 5-channel self capacitance detection, with adjustable capacitor charging and discharging frequency and support for frequency modulation mode;
Support simulated shielding of electrode function;
9 GPIO channels, 5 of which support ADC input, including a pair of differential input channels;
14 bit SAR ADC, 500K SPS for fast capacitive sampling;
PGA supporting offset voltage compensation, 1x-16x adjustable gain;
Supports SPI and UART serial ports;
4-channel 16 bit PWM;
Integrate LIN transceiver physical layer;
The data link layer complies with LIN2. x and J2602 standards;
LIN interface supports switching between 115Kbps high-speed mode and 20Kbps regular mode;
Internally integrated temperature sensor with room temperature accuracy range of ± 3 ° C;
Independent SWD high-speed programming interface, used for fast programming on the production line, greatly improving production efficiency;
The power supply pin VS complies with ISO7637 and ISO16750 surge and transient voltage standards;
Encapsulation DFN16 3mm * 4mm;
AEC-Q100 Grade 1,Tj=-40°C~150 °C;
Internal block diagram of chip
Image 6. png
Figure 1 System Framework Diagram
Product advantages
Minimalist peripheral components save overall BOM costs
The product design phase fully considers EMC requirements and only requires a small number of peripheral components to meet automotive EMC requirements.
National industrial chain single-crystal chip design enhances cost-effectiveness and reliability
TCAE10 adopts the leading national industrial chain mixed signal single wafer process, integrating high-voltage analog, embedded storage, and other analog and digital peripherals into a single chip, while optimizing the chip's functionality and performance to achieve a better balance between cost and performance.
High performance self capacitance capacitor detection
The application diagram of TCAE10 is shown in Figure 2, and the simulated shielding electrode function provides good waterproofing; Performance: When the Shield channel is working, the waveform following the detection channel is shown in Figures 3 and 4;
The capacitance detection method based on the principle of charge balance provides high signal-to-noise ratio and anti-interference performance. The SNR signal-to-noise ratio waveform is shown in Figure 5;
Adjustable capacitor for detecting charging and discharging time and frequency;
Customize the number of charge and discharge cycles, frequency balance performance, and power consumption;
FM mode improves external radiation;
Simulate switch mode charging and discharging to reduce the voltage rise and fall edges during charging and discharging, and reduce external radiation;
Mature baseline tracking algorithms respond to complex external environmental changes;
low power consumption
Thanks to the single-chip design of TCAE10, the power consumption modes between internal units can be flexibly configured to meet the requirements of various application scenarios for power consumption modes.
In typical application scenarios, supporting LIN wake-up mode, the standby power consumption of the chip can achieve a target of less than 50uA, which can easily meet the power consumption requirements of almost all car manufacturers for components and leave sufficient power margin for peripheral auxiliary circuits.
High production efficiency
Independent SWD debugging and programming interface, meeting the needs of fast program programming and debugging on the production line.
Good LIN compatibility
The TCAE10 LIN transceiver and data link layer are based on the mature LIN transceiver IP design of Taisi Microelectronics, which can well meet the latest LIN compatibility requirements such as LIN2. X and SAEJ2602021.
Excellent EMC characteristics
TCAE10 has focused on EMC issues since the chip design stage, adding necessary protective measures in circuit design such as power management and LDO to improve PSRR performance, making the TCAE10 solution easily pass EMC standards such as ISO7637, ISO16750, ISO11452, CISPR25, SAEJ2962-1 testing.
High working environment temperature
TCAE10 supports a maximum working environment temperature of 150 ℃, effectively meeting the needs of high-temperature applications such as small volume and high brightness reading lights.
Typical application scenarios
Including reading lights, door handles, tailgate kick, steering wheel release detection, window lift switches, etc. (Figure 6-Figure 9).
Ecology, tools, and technical support
In order to facilitate users to quickly evaluate solutions and help projects land quickly, Taisi Micro provides the TCAE10 EVK development board for users to use, as well as a complete SDK development package, which can be accessed through sales@tinychip.com.cn consulting service
About Taisi Microelectronics
Shanghai Taisi Microelectronics Co., Ltd. was established in Zhangjiang, Shanghai in 2019, and is a leading high-performance dedicated MCU chip supplier in China. The company focuses on the research and development of various high-performance analog-to-digital hybrid chips, covering multiple fields such as automotive, medical, industrial, and consumer, and has gained recognition and product introduction from numerous top customers in related application areas. The company has currently obtained the certification of high-tech enterprise and the title of specialized, refined, unique and new small and medium-sized enterprise.
Taisi Microelectronics has made a deep layout in the field of automotive chips and has successfully passed the ISO26262 ASIL-D system certification and ISO9001 quality system certification for automotive functional safety. Multiple products have obtained AEC-Q100 automotive chip certification and have accumulated dozens of invention patents. At present, six product series have been formed, including signal chain, battery management, power management, automotive touch control, car lighting system and motor drive control, forming a matrix product lineup.
Taisi Microelectronics always insists on creating innovative and market demand compliant products, creating good products, a simple and easy-to-use ecosystem, stable and mature vertical solutions, and striving to become the backbone of China's semiconductor development and the backbone of entering the international semiconductor market.
This is reported by Top Components, a leading supplier of electronic components in the semiconductor industry
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Media Relations
Name: John Chen
Email: salesdept@topcomponents.ru