From September 25 to 27, the "2024 China Integrated Circuit Design Innovation Conference and the Fourth IC Application Show", sponsored by China Integrated Circuit Design Innovation Alliance, Wuxi National High tech Industrial Development Zone Management Committee, the National "Core Fire" Innovation and Entrepreneurship Base (Platform), and Xinmaitong Exhibition, was held in the Taihu Lake International Expo Center.

The theme of this year's ICDIA is "Application Innovation, Creating a New Ecology", with "AI Application Needs and Technological Development" as the main line. It focuses on the exchange and discussion of AI big models and chip technology, RISC-V ecology, communication and RF technology, IC design and innovation in China chip, etc., sharing innovative achievements, hot directions, latest technologies, industrial progress and future applications in the field of integrated circuit design.

The conference will last for two days, integrating a summit forum, four special forums, enterprise exhibitions, authoritative releases, and supply and demand docking, providing a cooperation and exchange platform for showcasing new IC products, technologies, and applications. 6000+square meters exhibition area, 200+exhibitors showcasing IC innovation achievements and complete machine applications, 200+industry experts, 500+corporate executives, and 5000+industry guests attending.

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summit

On the morning of September 26th, the summit forum was chaired by Cheng Jinge, Secretary General of the China Integrated Circuit Design Innovation Alliance.

Ms. Lu Min, Deputy Mayor of Wuxi Municipal People's Government, Professor Wei Shaojun, National 01 Special Technology Chief Engineer and Chairman of China Integrated Circuit Design Innovation Alliance, Mr. Ye Tianchun, National 02 Special Technology Chief Engineer and Secretary General of China Integrated Circuit Design Innovation Alliance, Mr. Zeng Weiwei, Second level Researcher of the Technology Department of the Frontier Technology Department of the Ministry of Science and Technology, Mr. Zhang Jinwei, Deputy Secretary of the Party Working Committee, Deputy Director of the Management Committee, Deputy Secretary of the Xinwu District Committee, and District Chief of Wuxi High tech Zone, Mr. Zuo Baochun, Deputy Director of Wuxi Industry and Information Technology Bureau, Mr. Du Xiaoli, National 01 Special Technology Deputy Chief Engineer and Executive Vice Chairman of the Alliance, Mr. Shi Longxing, Chairman of Jiangsu Integrated Circuit Association, Professor of Southeast University, and Leader of the Alliance Expert Group, and Mr. Zuo Baochun, Deputy Director of Wuxi Industrial and Information Technology Bureau, Mr. Du Xiaoli, Mr. Ren Qiwei, Vice Chairman of the Alliance and CEO of Ziguang Spreadtrum, Mr. Chen Junning, Chairman of the Anhui Integrated Circuit Industry Association, Professor at the University of Science and Technology of China, and member of the 01 Special Expert Group, Professor Yin Shouyi, Vice Dean of the School of Microelectronics at Tsinghua University, Professor Sun Hongbin, Vice Dean of the School of Artificial Intelligence at Xi'an Jiaotong University, as well as several senior experts from the National 01 Special Project and Alliance, attended the event.

Also in attendance at the conference were leaders from the Wuxi Municipal Bureau of Industry and Information Technology, relevant departments of Wuxi High tech Zone, relevant governing units of the China Integrated Circuit Design Innovation Alliance, leaders from the National "Xinhuo" Double Innovation Base (Platform), leaders from various provincial and municipal integrated circuit industry associations, as well as outstanding integrated circuit enterprises, industry experts and professors, investment institutions, and media professionals from both domestic and foreign sources.

Lu Min, Deputy Mayor of Wuxi Municipal People's Government, delivered a speech at the conference. She stated that Wuxi is a national hub for integrated circuits and has undertaken the construction of the national 65, 75, microelectronics engineering, and 908 engineering projects. It has become the southern base of the national microelectronics industry and the Huangpu Military Academy for integrated circuits in China, as well as a talent cradle. Next, Wuxi will actively connect with the development strategy and deployment of the national and provincial integrated circuit industry, seize the major opportunities of the integration of the Yangtze River Delta and the development of the the Taihu Lake Bay Science and Technology Innovation Belt, and focus on the development of strategic priorities such as the information and innovation chip ecosystem, the car scale chip innovation circle, the high-end power semiconductor industry chain, and the third-generation semiconductor industry chain.

Zhang Jinwei, Deputy Secretary of the Party Working Committee, Deputy Director of the Management Committee, Deputy Secretary of the Xinwu District Committee, and District Mayor of Wuxi High tech Zone, delivered a speech at the conference. He stated that Wuxi High tech Zone, as the forefront and main battlefield of Wuxi's integrated circuit industry, has gone through 30 years of cultivation and precipitation, gathering enterprise clusters from one factory, extending from one chip to thousands of industries. Next, with the care and assistance of the Municipal Party Committee and Government, Wuxi High tech Zone will continue to promote the development of the integrated circuit industry in Wuxi along the path of one, two, three, four, five, and five, and strive to create a strong industrial chain and competitive advantages, focusing on building an industrial cluster area with significant scale benefits.

Yin Shouyi, Vice President of School of Integrated Circuits of Tsinghua University, Ren Qiwei, Executive Vice President of New Unisplendor Group and CEO of Unisplendor Zhanrui, Sun Hongbin, Vice President of School of Artificial Intelligence of Xi'an Jiaotong University, Shi Nuannuan, Researcher of Key Laboratory of Optoelectronic Materials and Devices of Institute of Semiconductor, Chinese Academy of Sciences, Shi Wenpeng, Director of China Home Appliances Research Institute, Yang Hongjian, General Manager of Matching Business Department of Electronic Components and Integrated Circuits International Trading Center Co., Ltd., and Bao Yungang, Deputy Director of Institute of Computing Technology, Chinese Academy of Sciences delivered keynote speeches respectively. Explored industry hot topics such as AI chips, embodied intelligence, optoelectronic computing chips, home appliance chips, and processor chip technology.

At the afternoon summit forum, He Ning, Senior Vice President and Chief Technology Officer of Beijing Yisiwei Computing Technology Co., Ltd., Li Mengzhang, CTO of Xinyaohui Technology Co., Ltd., Zhao Yongchao, Head of Anmou Technology's Intelligent IoT and Automotive Business Line, Cao Lihong, Senior Director of Riyueguang Technology and Market Development, Sheng Fangwei, Senior Technical Expert of RISC-V CPU at Damo Institute, Shan Gang, Vice President of Marketing of Data Center Product Department at Lanqi Technology Co., Ltd., Li Liji, Global Vice President and General Manager of Asia Pacific Technology at Siemens EDA, Lan Bijian, CEO of Suzhou Fuhu Electronic Technology Co., Ltd., He Qing, CEO of Hangzhou Xingxin Technology Co., Ltd., and Li Lei, Researcher at Zhongke Nanjing Intelligent Technology Research Institute, delivered wonderful reports. The theme revolves around high-performance computing solutions, the combination of AI and EDA The application of AI in simulating chip design, large model assisted chips, etc.

Four major theme forums, fully aware of cutting-edge trends

On September 27th, the AI Big Model Empowerment Chip Design Forum, RISC-V Ecological Forum, Communication Chip and RF Technology Forum, and IC Design and Strong Chip IC Roadshow were held simultaneously. Representatives from over 40 companies, including chip design, packaging and testing, universities, and academic institutions, shared cutting-edge technology trends and industry insights. At the Strong Chip IC roadshow, 14 outstanding companies introduced their latest products and technological innovations.

2024 Strong Chip China - Innovation IC Selection

At the welcome dinner on September 25th, the "Strong Chip China - Innovative IC Evaluation and Release" award ceremony organized by the China Integrated Circuit Design Innovation Alliance was held grandly.

The award-winning companies of "2024 Strong Chip China - Innovative IC" were announced on site. Ren Qiwei, Vice Chairman of China Integrated Circuit Design Innovation Alliance, Liu Weiping, Executive Director of China Integrated Circuit Design Innovation Alliance, Shi Longxing, Chief Professor of Southeast University and Expert Group Leader of China Integrated Circuit Design Innovation Alliance, Cheng Jinge, Secretary General of China Integrated Circuit Design Innovation Alliance, Ye Tianchun, Executive Vice Chairman of China Integrated Circuit Design Innovation Alliance, and Wei Shaojun, Chairman of China Integrated Circuit Design Innovation Alliance, presented awards to the award-winning companies and took photos together.

This selection has received active participation from nearly 200 companies. After being screened by the editorial board of China Integrated Circuit Magazine and 7 experts from the alliance expert group, a total of 36 award-winning companies and their representative products were ultimately selected for the Excellent Product Award, Excellent Product Award, Innovative Application Award, and Emerging Product Award. They are respectively:

Excellent Product Award

Ziguang Zhanrui (Shanghai) Technology Co., Ltd

Haiguang Information Technology Co., Ltd

Lanqi Technology Co., Ltd

Beijing Xinchi Semiconductor Technology Co., Ltd

Guangdong Yuefang Technology Co., Ltd

Excellent Product Award

Pingtou Ge (Shanghai) Semiconductor Technology Co., Ltd

Anmou Technology (China) Co., Ltd

Beijing Zhongdian Huada Electronic Design Co., Ltd

Shenzhen Huiding Technology Co., Ltd

Guangzhou Ankai Microelectronics Co., Ltd

Juxin Technology Co., Ltd

Shanghai Anlu Information Technology Co., Ltd

Zhuhai Yiwei Semiconductor Co., Ltd

Hexin Xingtong Technology (Beijing) Co., Ltd

Zhuhai Xin Power Technology Co., Ltd

Innovation Application Award

Shenzhen Jiangbolong Electronics Co., Ltd

Zhaoyi Innovation Technology Group Co., Ltd

Shanghai Beiling Co., Ltd

Beijing Zhixin Microelectronics Technology Co., Ltd

Black Sesame Intelligent Technology Co., Ltd

Guangdong Saifang Technology Co., Ltd

Sheng Microelectronics (Suzhou) Co., Ltd

Suzhou Naxin Microelectronics Co., Ltd

Chengdu Xuanji Xingyuan Information Technology Co., Ltd

Hangzhou Jinghua Microelectronics Co., Ltd

New Product Award

Geke Micro Co., Ltd

Hunan Guoke Microelectronics Co., Ltd

Zhongxing Micro Technology Co., Ltd

China Electronics Technology Group Shentai Information Technology Co., Ltd

Zhuhai Quanzhi Technology Co., Ltd

Qingdao Xinxin Microelectronics Technology Co., Ltd

Shanghai Hejian Industrial Software Group Co., Ltd

Hefei Kuxin Microelectronics Co., Ltd

Aixin Yuanzhi Semiconductor Co., Ltd

Meixinsheng Technology (Beijing) Co., Ltd

Shiqing Intelligent Technology (Shanghai) Co., Ltd

The "2024 Strong Chip China - Innovative IC" aims to select a group of strong chip products with leading technology, strong competitiveness, and reliable quality for key areas such as AI computing power, storage, microprocessors/controllers, FPGA, RF communication, power management, and power and drive across the country. Recommend high-quality domestic chips for system manufacturers and user units, and promote the application of domestic ICs.

IC Show

The offline exhibition IC Show at the venue organized over 100 domestic chip companies, innovative Chinese chips, automotive electronics, and more than 1500 domestic electronic product suppliers to gather together, co creating technological innovation and design inspiration, and building an exchange and cooperation platform from chips, system integration, to whole machine applications.

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